
PM Modi Inaugurates CG Semi's OSAT Facility in Sanand on 4 July 2026
Prime Minister Narendra Modi inaugurated the CG Semi Outsourced Semiconductor Assembly and Test facility in Sanand, Gujarat on 4 July 2026, marking the commercial start of one of India's first major semiconductor packaging plants. The facility represents a Rs 7,600 crore investment — approximately $870 million — structured as a joint venture between CG Power and Industrial Solutions, Renesas Electronics America (a subsidiary of Japan's Renesas Electronics), and Thailand's Stars Microelectronics. During the inauguration, PM Modi visited the facility's clean room and Experience Centre, interacted with engineers and operators, and unveiled the inauguration plaque. The first packaged semiconductor product from the plant was formally handed over to Renesas Electronics India at the ceremony.
CG Semi's G1 pilot plant is operational at a daily production capacity of approximately 0.5 million semiconductor units. The facility is targeting a peak annual capacity of 4.7 billion units over the next five years — a scale that would make it one of the largest semiconductor packaging operations in South Asia. The Sanand plant is India's third semiconductor facility to enter commercial operations in 2026.
What OSAT Is and Why India Started Here
Outsourced Semiconductor Assembly and Test is the segment of the chip supply chain that sits between a silicon fabricator and the end customer. A fab prints circuit patterns onto silicon wafers using lithography. An OSAT facility receives those finished wafers, dices them into individual chips, encases each chip in a protective package that connects to circuit boards, and tests each packaged unit before shipment. Every chip in a phone, laptop, automobile, or server passes through a packaging facility on its way from wafer to finished product.
India chose OSAT as its immediate entry point into semiconductor manufacturing for a straightforward reason: it is operationally and financially achievable on a shorter timeline than front-end silicon fabrication. A state-of-the-art silicon fab requires $10 to $20 billion in capital, five or more years of construction, and a decades-long technology learning curve. An OSAT facility at CG Semi's scale can be built and commissioned in two to three years at a fraction of that investment. The risk profile is also lower: packaging processes are more standardised and the equipment less specialised than the EUV lithography machines that front-end fabs require.
This practical calculus shaped India's semiconductor policy. The India Semiconductor Mission, approved with a total budget of Rs 76,000 crore, has sanctioned 12 semiconductor projects with a combined investment pipeline of approximately Rs 1.64 lakh crore. Of the 12 projects, nine are packaging and OSAT operations. Only one is a silicon fabrication unit — the Tata-PSMC fab planned for Dholera in Gujarat. CG Semi's Sanand facility is among the nine packaging projects that are advancing India's semiconductor ecosystem before the front-end fab is even commissioned.
The Sanand Cluster and the Micron Precedent
Sanand is not a random location. Micron Technology's semiconductor assembly and test facility in Sanand opened in 2024, the first major semiconductor manufacturing investment in India by a US company. Micron's presence established Sanand as a viable location for advanced manufacturing: the state government had prepared land, utilities, and industrial zoning specifically for semiconductor use, and a supporting workforce and vendor ecosystem had begun forming around the Micron site.
CG Semi's facility, operating in the same location, deepens that cluster. The colocation of two independent OSAT operations with different customers and supply chains creates cluster economics: shared talent pools, proximity to common suppliers of packaging materials and chemicals, testing equipment service providers, and a self-reinforcing signal to future investors that Sanand has the industrial infrastructure and policy support that chip manufacturing requires. Kaynes Technology is also among the companies with semiconductor operations in the Sanand vicinity. The comparison to Taiwan's Hsinchu Science Park or Malaysia's Penang semiconductor region is premature at this scale, but the structural intent is the same.
The Commercial Logic of the Three-Way Joint Venture
The structure of the JV between CG Power, Renesas, and Stars Microelectronics reveals how India's semiconductor mission is actually working in practice. Each partner contributes what the others cannot readily replicate.
CG Power and Industrial Solutions provides the Indian industrial foundation: the entity that qualifies for PLI scheme incentives under the India Semiconductor Mission, the land and facility in Sanand, and the domestic relationships with state and central government that semiconductor projects in India's policy environment require. Renesas Electronics brings guaranteed customer demand — it designs chips that need packaging, and the first product to roll off the Sanand line was a Renesas component — alongside semiconductor design intellectual property and a long-term procurement commitment that gives the facility a credible revenue floor from day one. Stars Microelectronics contributes established OSAT manufacturing process knowledge from its Thai operations, reducing the time needed to qualify packaging processes and train Indian operators from scratch.
This division of roles reflects the reality of India's semiconductor entry strategy: leverage foreign manufacturing expertise and guaranteed demand to get facilities operational while building domestic capabilities incrementally. The limitation of this model is that the highest-value intellectual property — chip design and advanced process technology — remains outside India. The opportunity is that an operational facility generates real manufacturing learning, supply chain relationships, and a workforce whose skills compound over time.
What the Sanand Plant Means for India's AI and Software Ecosystem
For Indian software companies, AI startups, and hardware teams, the most direct implication of CG Semi's operational facility is not immediate chip availability for new customers — the facility's initial focus is packaging chips for Renesas's own product lines — but rather the demonstration that India's semiconductor ecosystem is moving from policy to production at measurable scale.
Domestic semiconductor packaging capacity, over time, reduces India's exposure to supply chain disruptions. The chip shortages of 2021 and 2022 affected Indian manufacturers of electronics, automobiles, and industrial equipment acutely, exposing how deeply Indian industry depended on packaging operations in Malaysia, Thailand, and Taiwan. An operational OSAT in Sanand does not protect India from all future disruptions, but it provides one more domestic node in the supply chain that can be directed toward Indian demand when needed.
India's fabless semiconductor design sector — which has grown substantially, with hundreds of chip design companies in Bengaluru, Hyderabad, Pune, and Chennai — will eventually need domestic OSAT capacity to move designs from wafer to packaged product without routing through South-East Asia. As CG Semi's facility scales toward its 4.7 billion-unit annual target, it becomes an increasingly practical option for Indian chip design companies that need packaging without international logistics overhead.
The Bottom Line
PM Modi inaugurated CG Semi's OSAT semiconductor packaging facility in Sanand, Gujarat on 4 July 2026 — India's third semiconductor plant to enter commercial operations in 2026. The Rs 7,600 crore facility is a joint venture between CG Power and Industrial Solutions, Renesas Electronics America, and Stars Microelectronics, operating at 0.5 million units per day in its G1 pilot phase and targeting 4.7 billion annual units over five years. The India Semiconductor Mission has sanctioned 12 semiconductor projects with a combined Rs 1.64 lakh crore investment pipeline, nine of which are packaging and OSAT operations. Alongside Micron's existing Sanand facility, CG Semi's plant marks the early formation of India's first semiconductor cluster — a critical step for a country whose ambitions in AI, electronics manufacturing, and technology self-reliance all depend on building domestic chip supply chain capability.
Frequently Asked Questions
What is CG Semi's OSAT facility in Sanand and when was it inaugurated?+
CG Semi's OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat is one of India's first major semiconductor chip packaging plants. It was inaugurated by Prime Minister Narendra Modi on 4 July 2026. The facility is a Rs 7,600 crore joint venture between CG Power and Industrial Solutions, Renesas Electronics America, and Thailand's Stars Microelectronics. The plant's G1 pilot operates at approximately 0.5 million packaged semiconductor units per day and is targeting a peak annual capacity of 4.7 billion units over five years. It is India's third semiconductor facility to enter commercial operations in 2026, operating under the India Semiconductor Mission.
What does an OSAT facility do and why is it significant for India?+
An OSAT (Outsourced Semiconductor Assembly and Test) facility receives silicon wafers from a fabrication plant, dices them into individual chips, packages each chip in a protective casing that connects to circuit boards, and tests each unit before shipment. Every chip in a phone, laptop, server, or automobile passes through a packaging facility. OSAT is significant for India because it is a more immediately achievable entry point into semiconductor manufacturing than front-end chip fabrication: a packaging facility can be built in two to three years at a fraction of the $10 to $20 billion capital required for a silicon fab. The India Semiconductor Mission has approved 12 semiconductor projects including nine OSAT operations, with CG Semi's Sanand facility among the first to reach commercial production.
What is the strategic significance of Sanand as a semiconductor location?+
Sanand is emerging as India's first semiconductor cluster. Micron Technology's semiconductor assembly and test facility in Sanand opened in 2024 as the first major US semiconductor manufacturing investment in India. CG Semi's facility, operating in the same location, adds a second major OSAT operation with different customers and supply chain relationships, deepening the cluster. Colocation creates shared talent pools, proximity to common suppliers, and a signal to future investors that Sanand has the infrastructure semiconductor manufacturing requires. The India Semiconductor Mission has approved 12 projects with a combined Rs 1.64 lakh crore investment pipeline, and Sanand's growing cluster positions it as the packaging hub within that programme.
Who are the joint venture partners in CG Semi and what does each contribute?+
The CG Semi joint venture has three partners. CG Power and Industrial Solutions is the Indian industrial partner, providing the entity that qualifies for India Semiconductor Mission PLI incentives, the Sanand land and facility, and domestic relationships with state and central government. Renesas Electronics America brings guaranteed customer demand — Renesas designs chips that need packaging, and the first product from the Sanand facility was a Renesas component — alongside semiconductor design intellectual property and long-term procurement commitment. Stars Microelectronics, based in Thailand, contributes established OSAT manufacturing process know-how from its Thai operations, reducing the time needed to qualify packaging processes and train Indian operators. This structure reflects India's semiconductor entry strategy: leverage foreign expertise and guaranteed demand while building domestic capability incrementally.
Written by
TechPillow Team
Sharing insights on technology, product development, and the Indian tech ecosystem.